document number: 31512 revision 25-oct-00 www.vishay.com 44 mdp 1645, 1646 vishay dale for technical questions, contact: ff2aresistors@vishay.com ordering information 45 46 schematic 16 number of pins mdp model thick film resistor networks, dual-in-line, molded dip scsi-bus signal terminator the mdp 1646 network consists of 21 resistors of 2 different values, internally divided into seven (7) identical three (3) resistor sections for scsi-bus terminator applications. r 1 r 2 r 1 8 9 16 1 330 ? 150 ? 1 16 v ee 270 ? 180 ? 820 ? v cc v cc outputs to ecl ttl to ecl translator the mdp 1645 network consists of 18 resistors of 3 different values, internally divided into six (6) identical three (3) resistor sections for ttl to ecl translation. mdp1645 schematic mdp1646 schematic ttl inputs circuit applications 330 ? features ? 0.190" [4.83mm] maximum seated height ? rugged, molded case construction ? low temperature coefficient (- 55 c to + 125 c), mdp 1645: 100ppm/ c, mdp 1646: 250ppm/ c ? compatible with automatic insertion equipment ? highly stable thick film ? reduces pc board space and reduces total assembly costs ? available in tube pack model/ resistor package standard temperature temperature weight pin no. power rating power rating tolerance coefficient coefficient max. @ 70 c max. @ 70 c (- 55 c to + 125 c) tracking ww % ppm/ c ppm/ cg mdp 1645 0.125 2.0 2 100 150 1.5 typical mdp 1646 0.125 2.0 5 250 150 1.5 typical standard electrical specifications
www.vishay.com 45 mdp 1645, 1646 vishay dale document number: 31512 revision 25-oct-00 for technical questions, contact: ff2aresistors@vishay.com pin 1 identification pin 1 0.310 0.010 [7.87 0.254] 0.250 0.005 [6.35 0.127] 0.010 + 0.005 - 0.002 [0.254 + 0.127] - 0.051] non-accumulative tol. 7 spaces 0.018 0.003 [0.457 0.076] 0.700 0.010 [17.78 0.254] 0.130 + 0.015 - 0.010 [3.30 + 0.381] - 0.254] 0.120 0.005 [3.05 0.127] 0.850 0.010 [21.59 0.254] 0.050 0.005 [1.27 0.127] 0.100 0.010 [2.54 0.254] 0.075 0.015 [1.91 0.381] 0.290 [7.37] min. 0.320 [8.13] nom. 0.360 [9.14] max. 0.030 [0.762] typ. dimensions in inches [millimeters] test thermal shock short time overload low temperature operation moisture resistance resistance to soldering heat shock vibration load life terminal strength insulation resistance dielectric withstanding voltage conditions 5 cycles between - 65 c and + 125 c 2.5 x rated working voltage 5 seconds 45 minutes at full rated working voltage at - 65 c 240 hours with humidity ranging from 80% rh to 98% rh leads immersed in + 260 c solder to within 1/16" of body for 10 seconds total of 18 shocks at 100 g's 12 hours at maximum of 20 g's between 10 and 2,000 hz 1,000 hours at + 70 c, rated power applied 1.5 hours on, 0.5 hour off for full 1000 hour period. derated according to the curve. 4 1/2 pound pull for 30 seconds 10,000 megohm (minimum) no evidence of arcing or damage (200 v rms for 1 minute) max. ? r (typical test lots) 0.50% ? r 0.25% ? r 0.25% ? r 0.50% ? r 0.25% ? r 0.25% ? r 0.25% ? r 0.50% ? r 0.25% ? r performance marking resistance permanency testing per mil- to solvents: std-202, method 215. solderability: per mil-std-202, method 208e. terminals: copper alloy, tin-lead plated. body: molded epoxy. weight: 1.5 grams. thick film resistor networks, dual-in-line, molded dip - 50 + 25 + 70 + 125 + 150 2.00 1.00 .125 mdp 1645 package & mdp 1646 package single resistor parameter unit mdp series maximum operating voltage vdc 100 voltage coefficient of resistance (typical) v eff < 50 ppm/ c operating temperature range c - 55 to + 125 storage temperature range c - 55 to + 150 technical specifications mechanical specifications power rating (watts) derating ambient temperature c
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